VIA C3 Part15
ttp://www.via.com.tw/en/resources/pressroom/2004_archive/pr040916_processor_naming.jsp
ttp://pcweb.mycom.co.jp/news/2004/09/17/101.html
>573-575
おまいらあふぉかw
ttp://www.via.com.tw/en/resources/pressroom/2004_archive/pr040518epf.jsp
> The new core is based on IBM's advanced 90nm SOI manufacturing process, providing a
> significant boost in processor speed within the same thermal bracket as current VIA
> processors, and reducing maximum power consumption to a mere 3.5W at 1GHz.
ttp://pcweb.mycom.co.jp/news/2004/09/17/101.html
>573-575
おまいらあふぉかw
ttp://www.via.com.tw/en/resources/pressroom/2004_archive/pr040518epf.jsp
> The new core is based on IBM's advanced 90nm SOI manufacturing process, providing a
> significant boost in processor speed within the same thermal bracket as current VIA
> processors, and reducing maximum power consumption to a mere 3.5W at 1GHz.
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